G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title orgで入手可能となる。初版は1999年6月発行。前版は2013年4月発行。

orgで入手可能となる。初版は1999年6月発行。前版は2013年4月発行。

With increased levels of integration

binary Data Matrix symbology for front-surface marking of metal lead-frame strips (also called ‘strips’)

The alignment mark is preferable to be implemented at frontside final metal and/or backside metal layer masking

本スタンダードは，Environmental

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title orgで入手可能となる。初版は1999年6月発行。前版は2013年4月発行。This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.